IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.
|Published (Last):||8 June 2008|
|PDF File Size:||10.10 Mb|
|ePub File Size:||14.92 Mb|
|Price:||Free* [*Free Regsitration Required]|
IPC – Moisture Sensitivity Classification for Non-IC Components
The packaging shall allow the polarity or part number markings to be visible for each device. 95503 or components that are Class 0 Sensitive shall be clearly marked as Class 0 on the external surface of the packaging.
Oxide 9530 devices shall be vacuum sealed in moisture proof antistatic material. Documents Flashcards Grammar checker. Gel Trays should remain the same for subsequent lots of the same component type.
A rigid container that holds one leaded component. All components must be loaded into black static dissipative 2″x2″ waffle packs. Best Commercial Practice Packaging of parts shall be sufficient to afford protection against deterioration and physical damage during shipment 950 the supply source to BAE Systems. Parts must be loaded consecutively from left to right, proceeding from top to bottom as viewed with the notch of the waffle pack positioned in the upper left hand corner with a consistent separation between rows and columns.
Use of any static generating material is strictly prohibited.
Packaging Requirement Codes
Use of individual bags or containers shall be used to insure adequate protection from physical contact with other parts. Moisture content prior to packaging shall not exceed 0. Solid board packaging is ideal for achieving exclusive. Multiple boards in an MBB shall be separated by slip sheets or other appropriate materials such as pink poly bags. So typically paper as it enters the waste stream The carrier shall be of a construction to allow component removal without tooling. Items that are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices.
Exterior containers shall comply with uniform freight and national motor freight classification rules or regulations or other carrier rules, as applicable to the mode of transportation.
Specific packaging requirements will be provided by the using factory through the supplier electronic replenishment process. Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs. Moisture transfer refers to the fact that certain solid waste Leaded surface mount technology electronic components must be packaged such that component lead integrity is not adversely affected during shipping by contact with the packaging. If there are any questions contact Microwave Manufacturing Engineering 6.
Static generating materials should be avoided. Parts should be pre-oriented, but must be face pic. A maximum of 5 devices shall ilc contained in a tray. Items which are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. The parts must not be held in the pockets by supplementary means within the tray.
The preferred cavity size should be mils. An ESD Package with ioc pockets that house the components. Gel Trays must be labeled on the cover and the bottom of the base with the supplier lot number and part number, PO number and BAE part number.
Packaging Requirement Codes
Additional information on this requirement can be found at the following site: Waffle pack capacity should be maximized within a manufacturing lot. With the notch of the waffle pack in the upper left hand corner, parts must be loaded left to right, and top to bottom. All the components shall be oriented in the same direction according to polarity or pin i;c markings.
Surface mount components shall be suitable for vacuum pick up, include caps as applicable. If there 953 any questions contact Microwave Manufacturing Engineering.
Moisture Sensitive devices shall be packaged in moisture proof, conductive material or packaged in moisture proof antistatic material with external conductive field shielding barrier. This code shall only be used on product provided by through Integrated Supplier Partnering Agreements. Tray capacity will be indicated on the purchase ipv.
The carrier shall have removable stops on each end and shall prevent the components from shifting in any direction.
Once a Tray is chosen all components of that size for the entire P. Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover. All components must be loaded into black static dissipative 4″x4″ waffle packs. The Gel retention ic must be the minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied.